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Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)

Contributors:
HerausgeberSuganuma, Katsuaki
Brand:Woodhead Publishing
Manufacturer:Woodhead Publishing
Product type:Taschenbuch
Product group:Buch
Pages Count:240
Publication Date:30.05.2018
EAN:9780081020944
Adult Product:
Height:9.02
Length:5.98
Width:0.55
Release Date:30.05.2018
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